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Silicone Thermal Encapsulant
Product description
Silicone insulating thermal encapsulant is made of silicone resin as the matrix and filled with ceramic powder of different particle sizes. It can be cured at room temperature or heated. It has the characteristics that the higher the temperature the faster the curing. Fully compliant with EU RoHS Directive requirements. In addition to the characteristics of high thermal conductivity, this product also has the characteristics of low thermal expansion rate and high insulation. It has excellent flow and leveling properties before curing. After curing, it will not come out of the protective shell due to alternating hot and cold use.
Sample application Quotation application
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Properties and Applications
Properties：
Good substrate adhesion
For various potting modes
Low viscosity, no exudation after curing
Low stress, effective protection of electrical components
Chemical and mechanical properties are stable

Applications：
Power Modules
LED luminaires
LED lighting assembly
LED driver

Typical performance
View typical performance
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