HTV Silicone Ag/Cu Conductive Glue
Product description
CR EMSG-101 series is silicone conductive glue filled with silver coated copper conductive powder. Available in one-part and two-part. It can be formed by FIP dispensing process. With low viscosity, it can guarantee short production cycle on any type of dispenser. At 150℃, it can be fully cured in 40 minutes, and the curing time shortens with the increase of temperature. Has high strength, good adhesion, low compression set, and good heat and moisture resistance.
Properties:
Suitable for FIP dispensing, saving labor and eliminating irrelevant waste
Can be dispensed on metal or plastic substrates
Excellent electromagnetic shielding performance
Good thixotropy and adhesion
Applications:
Military electronic equipment
Communication base station
Aviation and marine equipment
Automotive Electronics
